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Metal Core PCB Manufacturing Services
High-performance circuit boards using ceramic substrates with superior thermal conductivity, temperature resistance, and high-frequency characteristics.
- Materials
Nano-ceramic powder
High-precision conductive paste
- Process
Laser processing (50μm micro-holes)
Precision printing (50μm line width)
Controlled sintering (multi-stage temperature control)
- Surface
Selective electroplating
ENEPIG treatment
- Quality Control
Process inspection (AOI, X-ray)
Final product inspection (thermal shock, bending strength)
Special inspection (surface roughness, thermal conductivity)
Why Choose Ceramic PCBs?
High-performance substrates for demanding electronic applications
- High-Temp Resistance
Withstands extreme heat (ideal for power electronics/automotive)
- Superior Thermal Conductivity
AlN ceramics: 170-230W/mK (vs 1W/mK in standard PCBs)
- Chemical/Corrosion Proof
Resists harsh chemicals (critical for aerospace/medical)
- Built-in Insulation
No extra layers needed; safer for high-voltage use
- Metal Bonding Strength
Strong Cu/Ti adhesion with matched thermal expansion
- Durable & High-Frequency Ready
High hardness + low dielectric loss (perfect for RF/microwave)
- Electrical Safety
High breakdown voltage prevents leakage
Ceramic PCB Types & Materials
Advanced ceramic substrates engineered for specialized performance requirements
| Material | Dielectric Constant | Thermal Conductivity (W/mK) | Thermal Expansion (CTE × 10⁻⁶/°C) | Purity | Typical Applications |
|---|---|---|---|---|---|
| Alumina (Al₂O₃) | 22-30 | 6.0-8.0 | 7.0-8.0 | 92%-99% | LEDs, power electronics, sensors, automotive |
| Aluminum Nitride (AlN) | 8.5-10 | 170-200 | 4.0-5.0 | 99% | Power LEDs, high-power modules, semiconductor bonding |
| Silicon Nitride (Si₃N₄) | 7-9 | 80 | 3.0-4.0 | High purity | Automotive electronics, aerospace, RF applications |
| Silicon Carbide (SiC) | 40-42 | 120-150 | 4.0-5.0 | High purity | High-temperature electronics, lasers, space systems |
| Beryllium Oxide (BeO) | 6.5-7.5 | 200-300 | 7.0-8.0 | High purity | RF amplifiers, space and military applications |
| LTCC | 5.0-15.0 | 2-5 | 6.0-7.0 | Varies | RF devices, medical implants, sensors, automotive |
| Hybrid Ceramic | Varies | Varies | Varies | Varies | Automotive, industrial, communication systems |
Key Selection Criteria:
- Thermal Management: AlN and BeO offer highest conductivity
- Mechanical Strength: Si₃N₄ provides exceptional durability
- High-Frequency: Low dielectric materials (AlN, Si₃N₄) preferred
- Cost Efficiency: Al₂O₃ balances performance and cost
Ceramic PCB Manufacturing Process
High-performance circuit boards for demanding applications. Contact US
Substrate Preparation
- High-speed dispersion mixing of Al₂O₃ powder and PVB adhesive (3-5 wt%)
- Made into green ceramic tape by cast extrusion or dry pressing
Patterning
- Screen printing: Printing circuit patterns using conductive paste
- Laser processing: High-precision direct etching
Laminated
- Multiple layers of raw porcelain aligned and stacked
- Apply heat and pressure to temporarily bond them together.
Sintering
- High-temperature sintering at 1500-1600°C
- Binder removal & densification
Surface Treatment
- Electroless nickel/gold plating (ENIG)
- Thick metal layer electroplating treatment
Post-Processing
- aser/mechanical drilling
- Precision cutting
- X-ray/electrical testing