CAPABILITIES
Shanlian Electronics's Assembly Capabilities for PCBs
| ITEM | PCB | FLEX | RIGID-FLEX |
| Max Layer | 60L | 8L | 36L |
| Inner Layer Min Trace/Space | 3/3mil | 3/3mil | 3/3mil |
| Out Layer Min Trace/Space | 3/3mil | 3.5/4mil | 3.5/4mil |
| Inner Layer Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 10oz | 2oz | 3oz |
| Min Mechanical Drilling | 0.15mm | 0.1mm | 0.15mm |
| Min Laser Drilling | 0.1mm | 0.1mm | 0.1mm |
| Aspect Ratio(Mechanical Drilling) | 20:1 | 10:1 | 12:1 |
| Aspect Ratio(Laser Drilling) | 1:1 | / | 1:1 |
| Press Fit Hole Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH Tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
| NPTH Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| Countersink Tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
| Board Thickness | 0.2-8mm | 0.1-0.5mm | 0.4-3mm |
| Board Thickness Tolerance(＜1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Board Thickness Tolerance(≥1.0mm) | ±10% | / | ±10% |
| Impedance Tolerance | Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω) Difference：±5Ω(≤50Ω)，±7%(＞50Ω) | Single-Ended：±5Ω(≤50Ω)，±10%(＞50Ω) Difference：±5Ω(≤50Ω)，±10%(＞50Ω) | Single-Ended：±5Ω(≤50Ω)，±10%(＞50Ω) Difference：±5Ω(≤50Ω)，±10%(＞50Ω) |
| Min Board Size | 5*5mm | 5*10mm | 10*10mm |
| Max Board Size | 22.5*30inch | 9*14inch | 22.5*30inch |
| Contour Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
| Min BGA | 7mil | 7mil | 7mil |
| Min SMT | 7*10mil | 7*10mil | 7*10mil |
| Surface Treatment | Electroplated Nickel Gold,ENIG,Gold Finger,ImmersionSilver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold; Hard Gold Plating， Soft Gold Plating,Nickel Palladium | Electroplated Nickel Gold,ENIG,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold; Hard Gold Plating， Soft Gold Plating,Nickel Palladium | Electroplated Nickel Gold,ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold; Hard Gold Plating， Soft Gold Plating,Nickel Palladium |
| Solder Mask | Green,Black,Blue, Red,Matte Green | Green solder mask/ black cover film or yellow cover film | Green,Black,Blue, Red,Matte Green |
| Min Solder Mask Clearance | 1.5mil | 3mil | 1.5mil |
| Min Solder Mask Dam | 3mil | 8mil | 3mil |
| Legend | White,Black,Red,Yellow | White,Black,Red,Yellow | White,Black,Red,Yellow |
| Min Legend Width/Height | 4/23mil | 4/23mil | 4/23mil |
| Strain Fillet Width of Single layer board | / | The Board Thickness is 3-6 Times | The Board Thickness is 3-7 Times (Flexible board thickness) |
| Strain Fillet Width of Double layer board | / | The Board Thickness is 6-10 Times | The Board Thickness is 6-11 Times (Flexible board thickness) |
| Strain Fillet Width of Multi-layer board | / | The Board Thickness is 10-15 Times | The Board Thickness is 10-16 Times (Flexible board thickness) |
| Strain Fillet Width of Dynamic | / | The Board Thickness is 20-40 Times | The Board Thickness is 20-40 Times (Flexible board thickness) |
| Dispensing width | / | 1.5±0.5mm | 1.5±0.5mm |
| Warpage (minimum) | 0.30% | / | 0.05% |