14-Day
4-Layer PCBA Our Pledge
Faster & Professional Turnkey PCB Assembly Services
FPC Manufacturing Services
Topfast specializes in high-quality flexible PCB boards, including flat flexible cables, HDI flexible circuits, and multi-layer flexible PCBs with impedance control and optional stiffeners.
- ICT & FCT Testing
- UL, CE, FCC, RoHS Certified
- Nitrogen Reflow Soldering
- High-Standard SMT Assembly
Why Use Flexible PCBs?
- Thin & Flexible ➝ Saves space, reduces weight, ideal for wearables/foldable devices
- Dynamic & Durable ➝ Millions of bends, vibration-resistant, perfect for moving parts
- Simplified Design ➝ Replaces cables, reduces connectors, easier assembly
- Heat/Chemical Resistant ➝ Withstands harsh environments (automotive/medical)
- Better Signal Integrity ➝ Low loss in high-frequency apps, strong noise immunity
Advanced Flexible PCB Manufacturing Capabilities
High-quality flexible circuits for demanding applications
Layer Capacity
1-10 standard layers
Up to 16 layers for advanced designs
Precision Tolerances
3 mil traces/spacing
0.1mm laser drilling
Thickness Range
0.05mm to 0.5mm standard
Up to 0.8mm advanced
Detailed Specifications
Max layers: Up to 16
Line width/spacing (inner): 3/3 mil
Line width/spacing (outer): 3.5/4 mil
Copper thickness: 2 oz (inner/outer)
Mechanical drill: 0.1 mm min
Laser drill: 0.1 mm min
Board thickness: 0.1-0.5 mm
Thickness tolerance: ±0.05 mm
Impedance tolerance: ±5Ω (≤50Ω)
Board size: 5×10mm to 9×14″
Minimum BGA: 7 mil
Component size: 7×10 mil
Surface finishes: ENIG, HASL, OSP, etc.
Solder mask colors: Green, black PI, yellow PI
Legend options: White, black, red, yellow
Strain radius: 1.5±0.5 mm
Press-fit tolerance: ±0.05 mm
PTH tolerance: ±0.075 mm
Aspect ratio: 10:1
PCB Assembly Capabilities
High-precision assembly services for all your electronic manufacturing needs
Assembly Specifications
| Stencil Size Range | 29″ × 29″ (736.6mm × 736.6mm) |
| SMT Capabilities |
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| Wave-Soldering |
|
| Min. BGA Pitch | 0.008″ (0.20mm) |
| Max. BGA Size | 74mm × 74mm |
| BGA Ball Pitch | 1.00mm (Min) to 3.00mm (Max) |
| BGA Ball Diameter | 0.40mm (Min) to 1.00mm (Max) |
| QFP Lead Pitch | 0.38mm (Min) to 2.54mm (Max) |
Core Materials of Flexible PCBs
Precision-engineered material combinations for optimal performance and durability 📜 Substrate Materials
Polyimide (PI)
- High-temperature resistance (up to 400°C)
- Superior flexibility and bend endurance
- Low thermal expansion coefficient
PET (Polyester)
- Cost-effective alternative
- Moderate temperature resistance (up to 150°C)
- Good chemical resistance
- 📜 Substrate Materials
- ⚡ Conductive Layer
Rolled Copper Foil
- High-temperature resistance (up to 400°C)
- High-temperature resistance (up to 400°C)
- High-temperature resistance (up to 400°C)
PI Cover Film
- Excellent environmental protection
- Prevents oxidation and corrosion
- Available with or without adhesive
Photoimageable Solder Mask
- Precise pattern definition
- Improved solderability
- Enhanced insulation properties
- 🛡️ Coverlay/Insulation
FR4
- Provides localized rigidity
- Excellent dimensional stability
- Compatible with standard PCB processes
Steel Sheet
- Maximum durability for connector areas
- Enhanced heat dissipation
- Extreme mechanical strength
- 🏗️ Stiffener Options