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Metal Core PCB Manufacturing Services
Specialized circuit boards with metal substrates for superior heat dissipation in high-power applications.
- Customized Design
Supporting 1-12 layers of metal substrates
- Core Manufacturing
First-class technical team with mature product lines
- Quality Control
Thermal conductivity, insulation, pressure resistance testing
- Rapid Prototyping
2-7 days for prototype delivery
- Cost Optimization
Cost-effective aluminum substrate solutions
- Global Certifications
ISO 9001, IATF 16949, UL certified
- DFM Analysis
Design for Manufacturing support provided
Why Choose Metal Core PCBs?
High-performance thermal management solutions for demanding electronic applications
- Excellent Heat Dissipation
5-10 times faster than FR4, prevents component overheating
- High Mechanical Strength
Vibration resistant, suitable for automotive/aerospace applications
- Lightweight Design
Aluminum substrate ≈60% lighter than copper
- Long Service Life
High temperature resistance, aging resistance, suitable for harsh environments
Cost-effective aluminum substrate solutions
Main Types of Metal Core PCBs
Based on the choice of metal core material, metal core printed circuit boards (MCPCBs) can be divided into the following three main types
Aluminum Core PCBs
- Thermal Conductivity: 1-3 W/mK
- Cost-effective solution
- Lightweight construction
Aluminum core MCPCB, featuring lightweight, cost-effectiveness, and excellent thermal conductivity. Widely used in LED lighting, automotive electronics, and power supply applications.
Copper Core PCBs
- Thermal Conductivity: ~400 W/mK
- High-performance
- Durable construction
Copper-core MCPCBs have excellent thermal conductivity and are widely used in high-performance computing (HPC), telecommunications, and industrial equipment.
Mixed Metal Core PCBs
- Balanced performance
- Cost-performance optimized
- Custom configurations
Hybrid metal MCPCB combines the advantages of different metals to achieve a balance between performance and cost to meet specific needs.
Metal Core PCB Design Guide
Engineering best practices for optimal thermal performance and reliability
- Place thermal vias within 5mm of heat sources
- Recommended via diameter: 0.8-1.2mm
- Use thermal pads for components > 1W
Pro Tip: Maintain 3:1 aspect ratio for thermal vias
Spacing: ≥0.2mm for 30V, ≥0.5mm for 100V+
Power Components
- ≤5mm from core
- Group heat sources
Sensitive Circuits
- ≥15mm from heat
- Use isolation slots
- Matte black finish recommended
- 0.1mm clearance minimum
- 25μm thickness standard
EMC Design
Implement ground planes and shielding
Standards
Comply with IPC-2221/6012
Manufacturing
Confirm tolerances early
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