High-Performance Metal Core PCB (MCPCB) Manufacturing
1 – 12 Layers | 1 – 400 W/mK | Al / Cu Core | 99%+ Yield
- Aluminium 5052 / 6061 Metal Base
- 50 – 150 µm Thermal Dielectric
- 2 – 7 Day Prototypes, 99%+ Yield
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ISO 9001:2015
Certified Quality Control
IATF 16949
Automotive QMS
UL 94 V-0
Flame Retardant Base
RoHS & CE
Fully Compliant
100% Hi-Pot
Dielectric Withstand
Metal Core PCB Types by Substrate & Construction
Aluminium Core PCB
A copper circuit on a 1.0 – 3.2 mm aluminium plate, bonded through a thermally conductive dielectric. It is the workhorse of LED lighting and power supplies: heat leaves the LED straight into the metal, and the panel still prices like a commodity.
- Thermal path 5 – 10× better than FR-4 at a third of the cost of copper
- Lightweight and rigid, so long LED strips stay flat without an extra heatsink
- Used for streetlights, automotive lamps, power supplies and LED drivers
Copper Core PCB
A thick copper plate replaces aluminium where heat density is brutal. Conductivity close to 400 W/mK spreads heat across the whole base, so a 100 W device does not cook the dielectric directly beneath it, and the CTE sits close to that of copper-filled vias.
- Near-isotropic spreading for RF amplifiers, HPC and high-current drivers
- CTE close to copper reduces stress on large die and heavy solder joints
- Chosen for base stations, server power stages and laser diode mounts
Hybrid Metal Core PCB
Aluminium and copper zones in the same panel, joined by a selective bond. Copper is placed only under the hot components and aluminium carries the rest, so you pay for conductivity exactly where the thermal map needs it.
- Cut the copper area, keep the junction temperature
- Mixed grounding and shielding on one base plate
- Used for automotive lighting, mixed-signal modules and compact inverters
Multilayer MCPCB
Two to twelve circuit layers laminated onto a single metal base, with thermal vias dropping heat from inner power planes into the plate. It gives dense control circuitry and a heatsink in one part instead of a board plus a separate sink.
- Routing density of a multilayer board with an integrated heatsink
- Plated thermal vias carry heat through the dielectric into the base
- Used for LED drivers, motor controls, BMS boards and power modules
Aluminium Core vs Copper Core vs Hybrid MCPCB
FULL COMPARISON GUIDE (2026 THERMAL SUBSTRATE SELECTION)
| KEY PARAMETERS | Aluminium Core 1 – 3 W/mK | Copper Core ~400 W/mK | RECOMMENDED Hybrid MCPCB Al + Cu Combined |
|---|---|---|---|
Base Material Substrate Composition | Aluminium 5052 / 6061 | Copper C1100 | Al + Cu Selective Zones |
Thermal Path Dielectric & Base Conductivity | 1 – 3 W/mK(standard thermal prepreg) | Up to 400 W/mK(solid copper base) | 1 – 400 W/mK(zone by zone) |
Dielectric Layer Insulation & Bond Line | 50 – 100 µm | 25 – 75 µm | Mixed, Per Zone |
Thermal Cycling Long-Term Reliability | Dielectric Fatigue Risk(polymer under 125 °C cycles) | Heavier Assembly(mass needs mechanical support) | MITIGATEDMetal where it matters |
Cost Structure Material vs. Thermal Budget | Lowest Material Cost(commodity Al core) | 5 – 8× Al Cost(niche Cu core) | Balanced Hybrid CostCu only under hot parts(Al base, Cu inserts) |
Primary Applications Best Use Cases | LED Lighting, Power Supplies, LED Drivers | RF Amplifiers, HPC, High-Current Drivers | Automotive Lamps, Inverters, Power Modules |
| Source: Electronics Engineering & PCB Manufacturing Standards Guide (2026)DESIGN & SELECTION MATRIX | |||
What is a Metal Core PCB?
A metal core PCB replaces the fibreglass core of an FR-4 board with a solid aluminium or copper plate. The circuit is bonded to that plate through a thin thermally conductive dielectric, so heat flows from the copper trace straight into the metal instead of being trapped in an insulator.
- Metal Base Plate: A 0.8 – 3.2 mm aluminium or copper plate. It is the heatsink: it spreads heat laterally and adds mechanical stiffness to the whole board.
- Thermal Dielectric: A 50 – 150 µm epoxy layer filled with ceramic or alumina. It must insulate electrically while conducting heat, which is why its thickness sets the thermal resistance.
- Copper Circuit & Finish: 1 – 4 oz copper traces are etched on the dielectric, then masked and finished with ENIG or HASL so every pad stays solderable.
Key Advantages
- Heat Dissipation: Transfers heat 5 to 10 times faster than FR-4, dropping junction temperatures and stopping thermal throttling in high-power arrays.
- Mechanical & Vibration: A solid metal base resists shock, vibration and bending, so heavy transformers and long LED strips need no extra carrier.
- Lightweight Efficiency: Aluminium delivers most of the thermal benefit at roughly 60% less weight than a solid copper base.
- Dimensional Stability: Metal cores resist warping and delamination across wide temperature swings, which keeps solder joints intact in outdoor fixtures.
Why Choose Metal Core PCBs
Our lines bond 1 – 4 oz copper to aluminium and copper bases with a 50 – 150 µm thermal dielectric, holding dielectric breakdown above 3 kV and thermal resistance under 1.2 °C/W in volume.
- 1 – 12 Layers
Single-sided LED boards through 12-layer MCPCBs on one thermal line
- 1 – 400 W/mK
Aluminium 5052 / 6061 and C1100 copper cores, chosen against your thermal map
- ≤ 1.2 °C/W
Dielectric resistance verified by thermal impedance coupons on every lot
- 99%+ Yield
Hi-Pot, AOI and 100% E-test on every panel before packing
Core Advantages
Thermal Design Support: We read your thermal map, then pick aluminium, copper or a hybrid base and set the dielectric thickness so the junction temperature target is met.
Metal-to-Dielectric Bond: Vacuum lamination and a controlled cure keep the bond line void-free, which is what stops delamination after thermal cycling.
Certified Quality System: ISO 9001 and IATF 16949 processes with Hi-Pot, thermal impedance, AOI and microsection on every lot.
Fabrication + Assembly: Bare MCPCB, LED and power component sourcing and SMT assembly under one roof shorten the program schedule.
Proven Case Study
What is metal core PCB manufacturing?
Target Application
600 W High-Bay LED Module on a 2.0 mm Aluminium Core
Technical Challenge
A 600 W high-bay module had to hold its COB junction below 85 °C inside a sealed housing at 45 °C ambient, survive 1,000 cycles from -40 to +125 °C, and keep dielectric breakdown above 3 kV, while still costing less than a copper base.
Structure
Single-sided MCPCB, 2.0 mm aluminium 5052 base, 100 µm thermal dielectric, 2 oz copper, ENIG finish.
Slpcba Manufacturing Solution
- ✓ Base & Dielectric: 5052 aluminium plate with a 100 µm ceramic-filled dielectric, chosen so the COB pad sits under 1.2 °C/W without moving the whole board to copper.
- ✓ Thermal Via & Pad Design: A 24 mm exposed copper pad with a via field on a 3:1 aspect ratio drops heat straight into the base and keeps the spread uniform across the COB.
- ✓ Surface Finish & Mask: ENIG on the COB and connector pads, with a white reflective solder mask that survives 260 °C reflow without yellowing.
- ✓ DFM Review: Pre-production DFM covering thermal relief, via-to-pad spacing, base flatness and panel utilisation before the first lot.
Verified Results
- ✔ 97.8% Volume Yield: Six production lots held above 97% first-pass yield, with AOI and 100% E-test on every panel.
- ✔ 1.0 °C/W Measured: Thermal impedance coupons measured 1.0 °C/W through the dielectric, inside the 1.2 °C/W design target.
- ✔ Thermal Cycling Passed: 1,000 cycles from -40 to +125 °C with no delamination and no dielectric crack.
Why Choose Slpcba
Built for Thermal Conductivity, Metal Substrates and Repeatable Yield
Al & Cu Substrates
5052 / 6061 aluminium and C1100 copper bases from 0.8 to 3.2 mm thick
1 – 400 W/mK
Dielectric and base chosen against the thermal map, from LED boards to HPC modules
≤ 1.2 °C/W
Bond-line thickness and voiding held by vacuum lamination and coupons
Full-Stage QC
Hi-Pot, thermal impedance, AOI, flying-probe E-test and microsection on every lot.
Ready to Build Your Thermal-Managed MCPCB?
Upload your Gerber files and thermal map today for a free DFM review, a substrate proposal and a detailed quote within 24 hours.
Request a Quick Quote
Upload your Gerber files — DFM review & quote within 24 hours.
Engineering Capability
Technical Specifications & DFM Capabilities
| Parameter | Metric Value | Imperial Value | Feature Highlights |
|---|---|---|---|
| Layer Count | 1 – 12 Layers | 1 – 12 L | Metal Core Stackup |
| Thermal Conductivity | 1 – 400 W/mK | Al / Cu | Substrate Dependent |
| Min. Dielectric Thickness | 0.05 mm | 2 mil | Low Thermal Resistance |
| Min. Trace / Space | 0.10 mm (4 mil) | 0.004" | Etched Metal Base |
| Max Metal Base Thickness | 3.2 mm | 0.126" | Integrated Heatsink |
| Finished Copper Weight | Up to 4 oz (140 µm) | Up to 4 oz | Heavy Current Traces |
| Board Thickness | 1.0 – 4.0 mm | ±10% | Incl. Metal Base |
Premium Substrates & Surface Finishes
- Base Material: Aluminium 5052 / 6061 (1 – 3 W/mK) and copper C1100 (~400 W/mK), 0.8 – 3.2 mm plate
- Copper & Build: 1 – 4 oz ED copper, 50 – 150 µm thermal dielectric, single-sided to 12-layer MCPCB with thermal vias
- Surface Finishes: ENIG, Lead-Free HASL, Immersion Silver, Immersion Tin, OSP, Hard Gold
Surface Treatment Options
✔ HASL (Vertical or Horizontal)
✔ Lead-Free HASL
✔ ENIG (Electroless Nickel Immersion Gold)
✔ ENEPIG (Ni-Pd-Au)
✔ Immersion Silver
✔ Immersion White Tin
✔ OSP (Shikoku F2)
✔ OSP (Entek)
✔ Electrolytic Soft Gold
✔ Electrolytic Hard Gold
✔ Selective Hard Gold
MCPCB Fabrication Tolerances
| Parameter | Metric Value | Imperial Value |
|---|---|---|
| Min. Dielectric Thickness | 0.05 mm | 0.002″ |
| Max Metal Base Thickness | 3.2 mm | 0.126″ |
| Min. Metal Base Thickness | 0.8 mm | 0.031″ |
| Min. Mechanical Drill | 0.20 mm | 0.008″ |
| Min. Thermal Via | 0.30 mm | 0.012″ |
| Min. Trace / Space | 0.10 mm | 0.004″ |
| Max Board Thickness | 4.0 mm | 0.157″ |
| Thermal Via Aspect Ratio | 3 : 1 | Ideal 3:1 |
| Min. Solder Mask Dam | 0.10 mm | 0.004″ |
| Max Panel Size | 520 × 620 mm | 20.5″ × 24.4″ |
| Material Type | Example / Subtype | Function |
|---|---|---|
| Conductors | Heavy ED Copper (1 – 4 oz) | Electro-deposited foil up to 4 oz carries the current on LED and power traces, and still etches to a 4 mil line on the dielectric. |
| RA Copper (High Reliability) | Rolled annealed foil where thermal cycling is severe: its grain structure resists cracking at plated holes in automotive and aerospace builds. | |
| Metal Substrates & Dielectric | Aluminium 5052 / 6061 | 1.0 – 3.2 mm plate with 1 – 3 W/mK system conductivity, the cost-effective workhorse for LED and power boards. |
| Copper C1100 | Up to 400 W/mK, for extreme heat density in RF amplifiers, HPC and high-current drivers. | |
| Hybrid Al + Cu | Aluminium and copper zones bonded into one panel, so copper sits only where the thermal map needs it. | |
| Thermal Dielectric (50 – 100 µm) | Ceramic-filled epoxy that insulates while it conducts heat; its thickness is what sets the thermal resistance. | |
| High-Conductivity Dielectric | Thinner bond line with a high thermal filler, dropping resistance below 1.2 °C/W under power pads. | |
| Base Surface Finishing | Anodised or passivated metal side for corrosion resistance and better adhesion in outdoor fixtures. | |
| Insulators & Surface Finishes | ENIG | Electroless nickel with an immersion gold top layer: flat, solderable and stable for fine-pitch LED and driver pads. |
| Lead-Free HASL | Hot-air levelled tin-silver-copper finish, the most economical option for through-hole and coarse-pitch MCPCBs. | |
| Immersion Silver | Silver finish with excellent solderability for fine lines and press-fit parts, on a flat pad profile. | |
| OSP | Organic solderability preservative: an invisible, flat coating for boards assembled inside a short window. |
FAQ
Frequently Asked Questions About Metal Core PCBs
A metal core PCB bonds a copper circuit to a solid aluminium or copper plate through a thermally conductive dielectric. The metal base acts as an integrated heatsink, which is why MCPCBs are standard in high-power LED lighting, power converters, motor drivers, automotive lamps and battery management systems.
Aluminium cores run 1 to 3 W/mK at commodity cost and low weight, which suits LED lighting and power supplies. Copper cores reach about 400 W/mK for extreme heat density such as RF amplifiers, HPC and high-current drivers, at five to eight times the material cost and noticeably more weight.
Thinner dielectric: lowers thermal resistance, so heat reaches the base faster, but it also trims breakdown voltage margin.
Thicker dielectric: raises isolation and Hi-Pot headroom, at the cost of a higher junction temperature under the same load.
Rule of thumb: keep the bond line at 50 to 100 µm on LED boards and confirm the choice with a thermal impedance coupon.
Single-sided (1 layer), double-sided (2 layers) and multilayer MCPCBs up to 12 layers, with blind and buried thermal vias plus custom metal substrate bonds.
Place thermal vias within 5 mm of any heat source above 1 W, keep a 3:1 aspect ratio, and use 0.8 to 1.2 mm diameters under heat-sinking pads. Where the pad must stay flat, fill and cap the vias before masking.
ENIG for fine-pitch driver pads and long storage, immersion silver where solderability and cost both matter, and lead-free HASL for coarse-pitch through-hole work. White reflective solder mask is typical on LED boards because it lifts light output.
4/4 mil (100 µm) line and space, 0.20 mm mechanical drills, 0.30 mm thermal vias and a 50 µm dielectric in volume. Tighter geometry is a development capability, not a standard production specification.
Vacuum lamination with a controlled ramp and cure, an anodised or passivated base, and a bond line held inside 50 to 150 µm. Every lot is screened by thermal cycling and a peel test before shipment.
Yes. Every lot can ship with thermal impedance coupon data, Hi-Pot and dielectric breakdown results, microsection images, plus AOI and flying-probe reports.
Yes. Metal core fabrication, LED and power component sourcing and SMT assembly run under one roof, so a turnkey order arrives tested with one BOM, one freight and one quality gate.
MCPCB thickness is set by the metal base plus the dielectric and copper:
Single-sided LED boards: typically 1.0 – 2.0 mm (0.039 – 0.079″);
multilayer MCPCBs range from 2.0 – 4.0 mm (0.079 – 0.157″), commonly 2.0 mm (0.079″).
The metal base is cleaned and anodised, the thermal dielectric is laminated or coated on, copper foil is bonded and etched, then the panel is drilled, masked, surface finished, profiled and 100% electrically and Hi-Pot tested before packing.
ISO 9001, IATF 16949, UL 94 V-0 and RoHS. Boards are built to IPC-6012 Class 2 or Class 3 depending on the application, with IPC-2221 rules for clearance and thermal relief.
Key rules: keep thermal vias within5 mm of every heat source above 1 W, hold the dielectric bond line at 50 to 100 µm, keep solder-mask dams above 0.1 mm, and route heavy current on 2 to 4 oz copper so the base spreads heat evenly.
